| Field | Value |
|---|---|
| Operating Temperature | -55 to 200 ºC |
| Shielded Twisted Pairs (A) | 4 PLCS |
| Conductor (A) | AWG 24 (19/36) SPHSCA (2 PLCS) |
| Silver Plated High Strength Copper Alloy | |
| Insulation (A) | Strlppable ePTFE Over PTFE (2 PLCS) |
| Diameter Over Insulation (A) | 0.060 |
| Colors (A) | BN x WH |
| BU x WH | |
| GN x WH | |
| OR x WH | |
| Shield (A) | Aluminized Polyimide (Al Out) |
| Filler (B) | FEP/ePTFE |
| Diameter Filler (B) | 0.060 |
| Overall Binder (C) | 0.060 WALL ePTFE |
| Drain (D) | AWG 24 (19/36) SPHSCA (1 PLC) |
| (Silver Plated High Strength Copper Alloy) | |
| Overall Shield #1 (E) | Vacuum Deposited Aluminized Polyimide |
| Overall Shield #2 (F) | AWG 36 (1) SPC Braid |
| Overall Jacket (G) | (0.004) Wall Engineered Fluoropolymer |
| Marker Tape (H) | (0.125) Wide |
| Impedance | 100 ± 15 ohms Measured Differentially |
| Time Delay | 1.24 nsec/ft |
| Capacitance | 12.5 pF/ft |
| Nom. Attenuation @ 10 MHz per 100 ft. | 2.6 dB |
| Attenuation @ 100 MHz per 100 ft. | 8.4 dB |
| Attenuation @ 100 MHz per 200 ft. | 11.9 |
| Marking | Black Print |
| Note | Meets or Exceeds the Requirements of EIA/TIA-568—B.2 Category 6 for all Parameters except Attenuation. |